Silicon wafer cleaning agent

product introduction

The silicon wafer cleaning agent is composed of two parts: A and B. It is used in a ratio of 2:1. The effect is extremely outstanding and is suitable for cleaning silicon wafers in photovoltaic industries such as polysilicon and monocrystalline silicon.

product characteristics

1 Economy: It is a concentrated product, diluted at low concentration, and the average cleaning cost is low.

2 Efficiency: Good degreasing and degreasing effect, strong complexing ability, and high cleaning cleanliness.

3 Low foaming: This product has low foaming and is suitable for cleaning processes such as immersion, ultrasound and spraying.

technical parameters

technical parameters implementation standards

1 appearance colorless transparent liquid colorless transparent liquid visual

2 Specific gravity (20℃) 1.205±0.015 1.035±0.015 GB/T13377-2010

3 pH (25℃) 13.0±0.5 1.5±0.5 ASTM E70

4 cleaning temperature 50-60℃ 50-60℃ Q/OCKX001-2007 

scope of application

This product is only suitable for cleaning oil stains, suspensions, oxide layers, etc. of monocrystalline silicon, polycrystalline silicon, etc., and is not suitable for making velvet from monocrystalline silicon wafers.

use method

1 It is recommended to add 3-6 kilograms of silicon wafer cleaning agent concentrate (A:B=2:1) to every 100 kilograms of working fluid. When silicon wafers that are difficult to clean or have heavy oil stains, you can add cleaning agent in the middle according to the situation. In order to ensure the cleaning effect, it is recommended to replace it every shift, and it is recommended to use deionized water to configure the working fluid.

2 Generally, each kilogram of silicon wafer cleaning agent can process more than 2500 pieces of 125 #single crystal silicon wafers. The addition can be calculated based on this ratio. When encountering polishing silicon wafers with grinding paste and silicon wafers cut by recycled suspension, the amount of agent should be increased appropriately. Of course, the addition amount can also be appropriately reduced while ensuring the yield of silicon wafers.

4 During the cleaning process, the silicon wafer is exposed to the air as much as possible to prevent the production of flower chips.

5. It is recommended to clean silicon wafers according to the following cleaning process: pre-washing of pure water/citric acid (lactic acid) in the first tank; pure water in the second tank; ES-375 in the third tank; ES-375 in the fourth tank; pure water in the fifth tank (generally 3-4 tanks are rinsed with pure water).

precautions

1 The crystal bars after wire cutting must not be touched with water. If they cannot be cleaned in time, it is best to store them in suspension or cleaning agent (fully immersed).

2 Once the wire-cut ingot is put on the shelf for cleaning, it must be disposed of immediately. Moreover, the silicon wafer must not be allowed to dry naturally during the entire cleaning process.

3 When degumming, the silicon wafer must be kept moist and must not be dried naturally.

4 After each cleaning cycle is completed (such as shift change), completely replace the clean water tanks in tanks 5,6, 7 and 8.

5 In order to ensure the cleanliness of silicon wafer cleaning, it is best to control the spray and rinsing time before degumming to more than 30 minutes.

6. When working and using, it should be tested every 4 hours, but when the alkalinity drops or the cleaning is not clean, add this agent in time to ensure the effect of the working fluid.

Packaging:

25kg/barrel,200kg/barrel plastic barrel packaging.   

Shelf life:

2 years