Perfluorobutadiene (C4F6, hexafluorobutadiene, hexafluoro-1,3-butadiene) is a green and environmentally friendly efficient dry etching gas with extremely low greenhouse effect GWP. It is used for plasma dielectric etching of semiconductor products. It has a faster etching rate, higher selectivity and higher accuracy, and is more suitable for etching processes with high aspect ratio.
Perfluorobutadiene (C4F6) is a colorless, odorless and water-insoluble gas with a boiling point of 5.9 ° C. Perfluorobutadiene is a conjugated olefin containing six fluorine atoms and two carbon-carbon double bonds. As an excellent etching gas, due to its unique F/C ratio, perfluorobutadiene has higher etching selectivity, accuracy and aspect ratio than the traditionally used perfluorosaturated fluorocarbon etching gases, and can etch electronic circuits smaller than 100nm or even narrower. In addition, C4F6 has a higher selectivity for photoresist and silicon nitride than C4F8. When used, it can improve etching stability, improve etching rate and uniformity, thereby improving product excellence.
Molecular weight 162.03
ODP 0
GWP(100 years) 290
Atmospheric dwell time (days)<1
Boiling point (℃) 6
Freezing point (℃)-130
Critical temperature (℃) 139.6
Critical pressure (bar) 31.9
Liquid density (15℃, kg/l) 1.44
Steam density (kg/m3,@15 ℃) 6.8
Vapor pressure (25℃, bar) 2.11
Latent heat of vaporization (kJ/kg at melting point at 1.013 bar) 161.8
Flammable range in air ( %vol) 7-73
Perfluorobutadiene packaging:
The cylinder model is B10, with a size of 14cm and 83cm, an internal volume of 10.1 L, a gross weight of 14.7 kg, and a payload of 10kg. Packaging can be customized and changed according to user requirements
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