As a green and environmentally friendly new dry etching gas with low GWP value, hexafluoroisobutylene (2-trifluoromethyl-3,3,3-trifluoropropene;HFIB) can be used in pre-stage etching of semiconductors.
CAS No. 382-10-5
Molecular formula C4H2F6
Molecular weight 164.05
Boiling point (101.325kPa, ℃) 14.5
Solubility (23℃, g/L) 0.23
Density (101.325kPa, g/cm3) 1.39
Packaging specification of hexafluoroisobutylene: 4.64L/10.2L/44L steel cylinder
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