R116 refrigerant (hexafluoroethane, perfluoroethane, C2F6) can be used in a multifunctional etching technology commonly used in semiconductor production. It can be used for selective etching of metal silicides and metal oxides relative to their metal substrates. In addition, it is also used to etch silicon dioxide on silicon. As a dry etchant, hexafluoroethane has the advantages of extremely slight edge lateral erosion, high etching rate and high accuracy. It can well meet process requirements with small line widths and is widely used in semiconductor manufacturing processes.
R116 Refrigerant Parameters
| Name: R116, FC-116 | Chinese name: hexafluoroethane, electronic grade fluorocarbon, perfluoroethane, freon 116 |
| English full name: hexafluoroethane | Chemical molecular formula: CF3CF3, C2F6 |
| Molecular weight:138 | Standard boiling point: -78℃ |
| Critical temperature:20℃ | Critical pressure: 3MPa (absolute pressure) |
| Critical density: 0.613g/cm3 | CAS Number: 76-16-4 |
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